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MAX16824/MAX16825
High-Voltage, Three-Channel Linear
High-Brightness LED Drivers
ABSOLUTE MAXIMUM RATINGS
IN to GND ...............................................................-0.3V to +30V
OUT1, OUT2, OUT3 to GND ..................................-0.3V to +40V
CS1, CS2, CS3, REG to GND...................................-0.3V to +6V
PWM1, PWM2, PWM3 to GND .................................-0.3V to +6V
DIN, CLK, LE, OE , DOUT to GND ............................-0.3V to +6V
Maximum Current into Any Pin
Continuous Power Dissipation (T A = +70°C)
16-Pin TSSOP-EP (derate 26.1mW/°C above +70°C).......2089mW
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
(except OUT1, OUT2, OUT3) ........................................±20mA
Maximum Current into OUT1, OUT2, OUT3......................160mA
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
16 TSSOP
Junction-to-Ambient Thermal Resistance ( θ JA )...............+38.3°C/W
Junction-to-Case Thermal Resistance ( θ JC )......................+3°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial .
ELECTRICAL CHARACTERISTICS
(V IN = 12V, C REG = 1μF to GND, I REG = 0, R CS_ = 2 ? from CS_ to GND, T J = T A = -40°C to +125°C, unless otherwise noted. Typical
values are at T J = T A = +25°C.) (Note 2)
PARAMETER
Supply Voltage Range
GND Current
SYMBOL
V IN
I GND
CONDITIONS
I OUT1 = I OUT2 = I OUT3 =100mA
MIN
6.5
TYP
5
MAX
28.0
10
UNITS
V
mA
LED Current-Sense Accuracy
(Note 3)
10mA < I OUT_ < 100mA
10mA < I OUT_ < 150mA
5
7
%
Dropout Voltage (Note 4)
Output Current Slew Rate
Output Current Leakage
? V DO
I LEAK
I OUT_ = 100mA (current pulsed)
I OUT_ = 150mA (current pulsed)
Current rising, V OUT_ = 4V
V PWM1 = V PWM2 = V PWM3 = 0V
0.75
1.2
100
1.5
2.25
1
V
mA/μs
μA
CURRENT SENSE
Regulated CS_ Voltage
V CS_
V CS1 = V CS2 = V CS3
190
200
210
mV
OVERTEMPERATURE PROTECTION
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
+5V REGULATOR (REG)
165
23
°C
°C
Output Voltage
REG Output Current
REG Short-Circuit Current
V REG
I REG
I REGSC
I REG = 0mA (Note 5)
4.75V < V REG
V REG = 0V (Note 6)
4.75
4
15
5
40
5.25
90
V
mA
mA
LOGIC INPUT (PWM1, PWM2, PWM3)
PWM_ Input Bias Current
I PWM
V PWM1 = V PWM2 = V PWM3 = 5V
1
μA
PWM_ Input-Voltage High
PWM_ Input-Voltage Low
PWM_ Turn-On Delay
PWM_ Turn-Off Delay
V IH
V IL
50% of V PWM_ to 50% of ? V OUT_
50% of V PWM_ to 50% of ? V OUT_
4
0.6
475
150
V
V
ns
ns
2
Maxim Integrated
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